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KMID : 0381920150450040189
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Korean Journal of Microscopy
2015 Volume.45 No. 4 p.189 ~ p.194
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Cross-Sectional Transmission Electron Microscopy Specimen Preparation Technique by Backside Ar Ion Milling
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Yoo Jung-Ho
Yang Jun-Mo
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Abstract
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Backside Ar ion milling technique for the preparation of cross-sectional transmission electron microscopy (TEM) specimens, and backside-ion milling combined with focused ion beam (FIB) operation for electron holography were introduced in this paper. The backside Ar ion milling technique offers advantages in preparing cross-sectional specimens having thin, smooth and uniform surfaces with low surface damages. The back-side ion milling combined with the FIB technique could be used to observe the two-dimensional p-n junction profi les in semiconductors with the sample quality suffi cient for an electron holography study. These techniques have useful applications for accurate TEM analysis of the microstructure of materials or electronic devices such as arrayed hole patterns, threedimensional integrated circuits, and also relatively thick layers (>1 μm).
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KEYWORD
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Backside Ar ion milling, Curtaining effect, Transmission electron microscopy specimen preparation, Electron holography, Focused ion beam
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